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Page 26 of 31                            Kim et al. Soft Sci 2024;4:33  https://dx.doi.org/10.20517/ss.2024.28

               properties and explored its applicability in various applications such as channel layers for TFTs, transparent
               conductive electrodes, interlayers for optoelectronics, and thermoelectric power generation.

               Despite these remarkable advantages, the electrical conductivity and robustness of CuI remain inconsistent.
               Unstable iodine vacancy generation and shallow acceptor energy levels from copper vacancies or p-type
               dopants contribute to the instability of electrical conductivity and limit carrier concentrations. Additionally,
               the tendency of CuI to grow polycrystalline structures could result in uncontrollable grain growth and
               rough surfaces, degrading hole mobility. Many researchers are addressing these issues through various
               strategies and fundamental studies. These challenges highlight the significant potential for further
               enhancing the electrical properties of CuI, which make CuI comparable to transparent n-type metal oxide
               semiconductors.


               DECLARATIONS
               Authors’ contributions
               Structuring and writing the manuscript: Kim GH, Lee J
               Editing the manuscript: Ahn K
               Structuring and editing the manuscript: Kim MG


               Availability of data and materials
               Not applicable.


               Financial support and sponsorship
               This work was supported by the National Research Foundation of Korea (NRF) funded by the Ministry of
               Education (NRF-2023R1A2C2005451) and the Technology Innovation Program (RS-2023-00256870 and
               No. 20012617) funded by the Ministry of Trade, Industry & Energy (MOTIE, Korea).


               Conflicts of interest
               Kim MG is the guest editor of the Special Issue, while the other authors have declared that they have no
               conflicts of interest.


               Ethical approval and consent to participate
               Not applicable.

               Consent for publication
               Not applicable.

               Copyright
               © The Author(s) 2024.

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