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Page 2 of 16                            Hong et al. Soft Sci 2023;3:29  https://dx.doi.org/10.20517/ss.2023.20


               INTRODUCTION
               Thermoelectric materials, which can directly convert heat energy into electricity, have gained significant
                                                                                                  [1-3]
               attention because of their potential for sustainable energy harvesting from waste heat sources . With
               increasing concerns on energy efficiency and renewable energy sources, thermoelectric materials and
               devices have been explored for a wide range of applications, including waste heat recovery in industrial
               processes, automotive waste heat recovery, and powering wearable devices . The performance of
                                                                                    [4-6]
               thermoelectric materials is determined by the dimensionless figure of merit, zT , expressed by zT = S σT/κ,
                                                                                                     2
                                                                                 [7-9]
               in which S is the Seebeck coefficient, σ is the electrical conductivity, and κ is the thermal conductivity
               [comprising electron (κ ) and lattice (κ) thermal conductivities] [10-12] .
                                   e
                                               l
               Significant progress has been achieved to enhance zT through increasing S σ and decreasing κ. Since S, σ,
                                                                                2
                                                                                                l
               and κ  are coupled via the carrier concentration (n ), optimising n  is the prerequisite to maximise zT .
                                                                                                       [13]
                    e
                                                                        H
                                                           H
                                    2
               Electrically, to increase S σ, band engineering to align multiple band valleys has been established to ensure a
               large band degeneracy (N ) [14,15] . Improving the carrier mobility (µ ) is also a method to increase S σ  .
                                                                                                   2 [3,16-18]
                                                                        H
                                     v
               Thus, engineering light bands to reduce the band effective mass can effectively enhance thermoelectric
               performance. Other strategies that have also been proven to elevate S σ include introducing resonant energy
                                                                         2
               levels into the density of states (DOS), minority charge carrier filtering, and quantum confinement [19-21] .
               Thermally, κ can be decreased by enhancing phonon scatterings . This includes strengthening inherent
                                                                       [22]
                          l
               phonon-phonon interactions and introducing external scattering centres [23-26] . To identify the intrinsically
               strong phonon-phonon interactions, the acoustic and optical phonon branches should be overlapped in
               frequency to allow sufficient scattering channels [27-29] . The slope of acoustic branches should be as low as
               possible to ensure a small phonon group velocity [28,30,31] . Further reinforcing phonon scatterings is realised by
               introducing various types of nanostructures and lattice imperfections [32-34] .
               Additionally, the fabrication technique used to create thermoelectric materials and devices plays a crucial
               role  in  determining  their  performance [35-38] . Bulk  processing  techniques  involve  the  synthesis  of
               thermoelectric materials in a solid-state form, such as solid-state reaction, ball milling, or melt processing,
               followed by shaping and consolidation processes to obtain bulk materials with desired properties [39-42] .
               Vacuum deposition methods, such as sputtering and thermal evaporation, realize the deposition of thin
               films of thermoelectric materials onto substrates using vacuum chambers and specialized equipment [43-47] .

               While these traditional fabrication methods have been widely used in the field of thermoelectrics and have
                                                                 [48]
               resulted in significant advances, they also have limitations . For instance, bulk processing methods may
               have limitations in terms of achieving high-resolution patterning or complex geometries, and vacuum
                                                                               [49]
               deposition methods may be costly and complex for large-scale production . Additionally, these methods
               may require high processing temperatures or harsh conditions, which can limit the selection of materials
               and substrates .
                           [36]
               To harness the full potential of thermoelectric materials and devices, efficient and scalable fabrication
               methods are crucial . Among various fabrication techniques, printing methods have emerged as promising
                                [50]
               approaches for the production of thermoelectric materials and devices, offering advantages such as low cost,
               high throughput, and design flexibility [51-53] .

               Printing methods for thermoelectric materials and devices can be categorized into different types [Table 1],
                                                                                                       [64]
                                                                       [62]
               such as screen printing [54-57] , extrusion printing [58-61] , inkjet printing , aerosol jet printing , drop casting ,
                                                                                          [63]
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