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Wang et al. Soft Sci 2024;4:41 https://dx.doi.org/10.20517/ss.2024.53 Page 35 of 43

The fabrication technology of micro-cylindrical electronic devices is anticipated to advance towards higher
precision, reduced costs, enhanced material compatibility, and improved efficiency. The introduction of
novel materials and process improvements is expected to overcome existing technical bottlenecks, such as
the integration of flexible electronic materials and nanomaterials. Furthermore, as technology progresses,
micro-cylindrical devices will exhibit significant potential in emerging fields, including wearable devices,
smart healthcare, and environmental monitoring. Interdisciplinary integration will further propel the
development of this field, offering more innovative solutions for practical applications.

DECLARATIONS
Authors’ contributions
Conducted the literature review, outlined the manuscript structure, and wrote the manuscript draft: Wang
H, Wu H, Zhao C, Wu Q, Wang S, Zhang Z
Participated in the discussion of the review content: Zeng M, Wei H, Ye D
Initiated the reviewing idea and were involved in the discussion and revision of the manuscript: Wang H,
Wu H, Ye D, Huang Y
All authors have read the manuscript and approved the final version.

Availability of data and materials
Not applicable.

Financial support and sponsorship
This study was supported by the National Key Research and Development Program of China
(2021YFB3200703) and the National Natural Science Foundation of China (Grant Nos. 52175537,
52188102).

Conflicts of interest
Huang Y is the Editor-in-Chief of the journal Soft Science, while the other authors have declared that they
have no conflicts of interest.

Ethical approval and consent to participate
Not applicable.

Consent for publication
Not applicable.

Copyright
© The Author(s) 2024.

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