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Page 12 of 16 Hong et al. Soft Sci 2023;3:29 https://dx.doi.org/10.20517/ss.2023.20
materials design, process optimization, and device integration, thermoelectric printing has the potential to
revolutionize the field of thermoelectric materials and devices, offering sustainable and efficient solutions
for energy conversion and harvesting applications.
The field of thermoelectric printing has seen significant advancements in recent years, offering promising
prospects for the fabrication of thermoelectric materials and devices using printing techniques. These
techniques offer several advantages, including high scalability, flexibility in device design, and potential for
integration into various applications, such as wearable devices, energy harvesting systems, and smart
textiles.
However, there are still challenges and limitations that need to be addressed to fully realize the potential of
thermoelectric printing. These include the need for further optimization of printing parameters, materials
design, and post-treatment methods to achieve improved thermoelectric performance. Additionally,
standardized characterization methods and performance metrics for printed thermoelectric devices need to
be established for accurate comparison and evaluation.
Future research and development in the field of thermoelectric printing could focus on the exploration of
novel thermoelectric materials specifically designed for printing techniques, the advancement of printing
methods for complex device architectures, and the integration of printed thermoelectric devices into
practical applications. Further advancements in post-treatment methods, device characterization, and
understanding of the fundamental transport mechanisms in printed thermoelectric materials are also crucial
for advancing the field. Specifically, the future directions include:
(1) Further enhancing thermoelectric performance. Strategies for optimizing material design, device
structure, and printing parameters will be developed to result in improved thermoelectric properties of
printed materials. This, combined with advancements in printing precision and efficiency, will contribute to
increased power densities and enhanced practical application value of flexible thermoelectric devices.
(2) Ensuring reliability and stability. Ongoing research will focus on improving the reliability and stability of
printed thermoelectric devices. By optimizing material formulations and device architectures, as well as
understanding degradation mechanisms, longer lifespans and better performance in practical applications
can be achieved.
(3) Addressing the limitation of in-plane device. Improving heat transfer within the thin film structure is
crucial for enhancing the performance of in-plane devices. Strategies such as incorporating high thermal
conductivity layers or engineering thermal interfaces can enhance heat dissipation and improve the
temperature gradient across the device, resulting in improved thermoelectric efficiency.
(4) Realizing cost reduction and environmental sustainability. With the expansion of production scale,
process optimization, and equipment improvements, the cost of printed thermoelectric devices is expected
to decrease. This will make them more commercially viable and accessible for a wide range of applications.
The development of environmentally friendly printing materials and processes will be a significant focus.
Exploring thermoelectric materials that are abundant, non-toxic, and compatible with printing techniques,
as well as eco-friendly inks and post-treatment methods, will help reduce the environmental impact of
thermoelectric printing.

