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DECLARATIONS
Acknowledgments
We are grateful to Gao Qianwen (Analytical & Testing Center of NPU) for her help in the microstructure
characterization.
Authors’ contributions
Wrote the original draft: Xu, H.; Jing, C.; Xu, Z.; Zhan, H.
Supervised, reviewed, and revised the manuscript: Ye, F.; Chen, Q.; Zhu, M.; Kong, L.; Li, X.; Chai, X.; Qing,
Y.; Fan, X.; Luo, F.
Availability of data and materials
The data that support the findings of this study are available from the corresponding author upon
reasonable request.
Financial support and sponsorship
This work was supported by the National Natural Science Foundation of China (Grants Nos. 52302367,
52203094), the National Key Laboratory of Electromagnetic Information Control and Effects Open Fund
(Grants No. SYS1W2023010304), and the State Key Laboratory of Solidification Processing in NPU (Grant
No. 2025-TS-08).
Conflict of Interest
Xia Chai is affiliated with Shaanxi Huaqin Technology Industry Co., Ltd, while the other authors have
declared that they have no conflicts of interest.
Ethical approval and consent to participate
Not applicable.
Consent for publication
Not applicable.
Copyright
© The Author(s) 2025.
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