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Page 30 of 38 Wei et al. Soft Sci 2023;3:17 https://dx.doi.org/10.20517/ss.2023.09

textiles; however, the balanced development of electronic textiles in wearability, multimode sensing, power
supply, and other properties is a problem that needs to be solved.

(6) Intelligence: With the progress of artificial intelligence technology, electronic textiles have become an
ideal platform for human-machine interfaces. This is accelerating the practical applications in fields such as
smart medicine, interactive system, metaverse, and social services. In the future, we can expect to see even
more innovative uses of this technology. In the context of IoT and the 5G era, data processing technologies
are more advanced, such as cloud computing, big data, edge computing, etc. These technologies provide
convenient conditions for rapid data collection and information processing. The combination of electronic
textiles and artificial intelligence technology to construct a multimodal intelligent perception system is an
effective way to achieve intelligence. The current research focuses on the processing and analysis of
collected information by machine learning algorithms, including convolutional neural networks, artificial
neural networks, support vector machines, and more [230,231] . However, further research is needed for efficient
data fusion and decoupling of multimode information, as well as intelligent transmission and feedback of
information.

Although some problems and challenges have hindered the practical application of electronic textiles in
human-machine interfaces, their development potential as wearable electronic devices is enormous. With
the progress of science and technology, we firmly believe that the current challenges faced by electronic
textiles will be solved soon. To sum up, electronic textiles, as a new generation of wearable electronic
devices, will play an important role in our current era of intelligent interconnection.

DECLARATIONS
Authors’ contributions
Initiated the reviewing idea and outlined the manuscript structure: Wu J, Shi Q, Wei X
Conducted the literature review and wrote the manuscript draft: Wei X, Liang X, Meng C, Cao S
Involved in the discussion and revised the manuscript: Wu J, Shi Q
All authors have read the manuscript and approved the final version.

Availability of data and materials
Not applicable.

Financial support and sponsorship
This work was supported by the National Key R&D Program of China (2021YFB3600502,
2022YFB3603403), the National Natural Science Foundation of China (62075040).

Conflicts of interest
All authors declared that there are no conflicts of interest.

Ethical approval and consent to participate
Not applicable.

Consent for publication
Not applicable.

Copyright
© The Author(s) 2023.