Page 35 - Read Online

Page 6 of 23 Yun et al. Soft Sci 2023;3:12 https://dx.doi.org/10.20517/ss.2023.04

Table 1. A summary of experimentally demonstrated thermal management methods for wearable devices
Wearable Cooling performance
Technique Material Structure Application Ref.
platform (Other performance)
Conduction Cu Thin layer Patch-type 10 °C lower than without Heat dissipation from Jung
oximetry a metal layer PPG sensor et al. [46]
PDMS/BN Nanocomposite - Heat guidance using Substrate for multiple Kang
island selective heat chip arrays cooling et al. [131]
dissipating composite
[11.234 W/(m·K)]
BN/PVA Fabric Textile 55% higher than Heat transfer from the Gao
commercial cotton fabric skin et al. [113]
[0.078 W/(m·K)]
TPU/BN/GNR Fibrous mat Motion 32% drop of the Cooling resistance Tan
monitoring saturated temperature change under et al. [115]
[1.37 W/(m·K)] mechanical stimuli
Radiation SiO /Si N /Ag Multilayer Smartwatch 3.9 °C below the Colored cooler for Lee
4
2
3
ambient air in the wearable devices et al. [117]
daylight
SEBS Porous film Bioelectronic 6 °C cooling effects than Thermal management Xu
[118]
without film of on-skin electronics et al.
SEBS/PMMA Bilayer PTO Sub-ambient cooling of 6 Heat dissipation from Kang
[42]
porous film °C in daytime PPG sensor et al.
SEBS Multilayer porous Transformative 4.5 °C below the Prevent unwanted Byun
film electronic ambient air in the mode conversion in a et al. [43]
systems daylight hot outdoor
Convection / Cu/Ag/Nylon 6 Cu - 3 °C cooling effect with Rapid sweat transport & Peng
evaporation matrix/nanofiber greatly reduced sweat evaporation et al. [120]
consumption than
cotton
Aramid/MnO Nanofiber Textile 3.8 °C lower than cotton Personal comfort in Chen
2 [122]
membrane clothes activities et al.
CA/Al O /PA6/SiO Nanofiber Textile 16.6 °C lower than Personal comfort in Zhang
2 3 2 [123]
membrane cotton, 8.2 °C by activities et al.
management of the
humidity
MIL-101(Cr) Coating - Maximum temperature Moisture sorption- Wang
[124]
reduction of 7 °C desorption et al.
Phase change n-eicosane/melamine- Film with Substrate Minimized peak skin Thermal protection for Nie
[129]
material formaldehyde resin microsphere temperature rise by 82% skin et al.
Paraffin/Cu Embedded film Substrate Minimized peak Thermal protecting Shi
[130]
temperature rise by 85% substrate et al.
SAHM Hydrogel matrix Substrate 2 °C lower than without Personal comfort in Jung
[131]
heat sink activities et al.
PA@Cu/SE Substrate with Substrate 18.6 °C lower than pure Thermal protecting Sun
[132]
microcapsule SE substrate et al.
Thermoelectric p-/n-type Bi Te 3 TE legs - 8.2 °C lower than Personalized cooling Kishore
2
ambient air et al. [135]
Inorganic commercial TE pillars - 10 °C lower than without Personalized Hong
TE heat sink thermoregulation et al. [136]
p-type Bi Sb Te / TE fibers Textile 4.9 °C temperature Electric generator by Zhang
0.5 1.5 3 [104]
n-type Bi Se 3 difference between heat the difference between et al.
2
source and heat sink source and sink
p-/n-type Te TE pellets VR glove 13 °C temperature Switching sensations by Lee
[138]
difference in localized changing heat flux et al.
cooling and heating direction
PLCL/PEDOT:PSS Microfiber - 17 °C temperature Electric generator by Han
[139]
membrane difference between heat the difference between et al.
source and heat sink source and sink
temperature and sunlight) heat sources. Accumulated heat causes thermal adverse effects, such as thermal
discomfort, reduced device reliability, and skin burn when used indoors or outdoors. Nevertheless,