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Yun et al. Soft Sci 2023;3:12                                             Soft Science
               DOI: 10.20517/ss.2023.04



               Review Article                                                                Open Access



               Recent progress in thermal management for

               flexible/wearable devices


                                       #
                         #
               JooHo Yun , Young Jin Yoo , Hyung Rae Kim, Young Min Song *
               School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology (GIST), Gwangju 61005,
               Korea.
               #
                Both authors contributed equally.
               * Correspondence to: Prof. Young Min Song, School of Electrical Engineering and Computer Science, Gwangju Institute of Science
               and Technology (GIST), 123, Cheomdangwagi-ro, Gwangju 61005, Korea. E-mail: ymsong@gist.ac.kr
               How to cite this article: Yun J, Yoo YJ, Kim HR, Song YM. Recent progress in thermal management for flexible/wearable devices.
               Soft Sci 2023;3:xx. https://dx.doi.org/10.20517/ss.2023.04
               Received: 31 Jan 2022  First Decision: 2 Mar 2023  Revised: 15 March 2023  Accepted: 22 Feb 2023  Published: 18 Apr 2023

               Academic Editors: Dae-Hyeong Kim, Yihui Zhang  Copy Editor: Ke-Cui Yang  Production Editor: Ke-Cui Yang

               Abstract
               Thermal management for wearable devices is evolving to make ubiquitous applications possible based on
               advanced devices featuring miniaturization, integration, and ultrathin designs. Thermal management and control
               integrated with wearable devices are highly desirable for various applications for human body monitoring, including
               external heat exposure and metabolic heat generation, in various activities. Recently, dynamic change materials
               have been integrated with micro/nano thermal management platforms to address the potential for active thermal
               management. In this article, recent advances in the architecture of effective thermal management in wearable
               devices are reviewed, along with the essential mechanisms for managing thermal conditions for users in
               external/internal thermal environments. Appropriate thermal management approaches are proposed for the
               design and integration of materials/structures tailored to specific targets in wearable devices. In particular, this
               review is devoted to materials/structures based on five thermal management strategies: conduction, radiation,
               evaporation/convection, heat absorption/release, and thermoelectric (TE). Finally, the challenges and prospects
               for practical applications of thermal management in wearable devices are discussed.

               Keywords: Thermal management, wearable devices, thermal conductors, radiative coolers, evaporative textiles,
               thermoelectric devices











                           © The Author(s) 2023. Open Access This article is licensed under a Creative Commons Attribution 4.0
                           International License (https://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, sharing,
                           adaptation, distribution and reproduction in any medium or format, for any purpose, even commercially, as
               long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and
               indicate if changes were made.

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