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Ouyang et al. Microstructures 2023;3:2023027  https://dx.doi.org/10.20517/microstructures.2023.22  Page 3 of 10

               maximum applicable electric field. By using a thick LaNiO  buffer layer (~110 nm) on platinized Si and a
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               fast deposition rate, we successfully suppressed the growth of randomly-oriented, discontinuous columnar
               grains in the BaTiO  film directly deposited on the Pt electrode. Instead, we achieved a (001)-textured,
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               continuous columnar nanograin structure. This structure is similar to those obtained at low deposition
               temperatures [9,10]  but with an increased average grain size (~50-60 nm vs. 10-20 nm), resulting in an
               enhanced dielectric response. In comparison to the unbuffered films, the LaNiO -buffered BaTiO  films
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               exhibited a higher dielectric polarization under the same applied electric field (320 MV/m), leading to a
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               ~40% boost in the recyclable energy density of a film capacitor (81.0 J/cm  vs. 57.1 J/cm  @3.2 MV/cm).
               Furthermore, to break down the aspect-ratio conservation of the continuous columnar nanograin
                                                                                     [13]
               microstructure and its associated thickness scalable energy storage performance , we went back to the
               classic random polycrystalline BaTiO  film directly deposited on platinized Si. The rapid growth of its grain
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               size with deposition time led to an increasing polarizability/relative dielectric permittivity with the film
               thickness. Consequently, an enhanced energy storage density close to 50 J/cm  was achieved in device-level
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               thick BaTiO  films (46.6 J/cm  @300 V on a 1.3 μm thick film and 48.8 J/cm  @460 V on a 2.6 μm thick film).
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               These values are ~25 times higher than those of the BaTiO  ceramics and serve as an important benchmark
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               for the future development of multilayer ceramic capacitors (MLCCs).
               MATERIALS AND METHODS
               For the preparation of the platinized Si substrate, a Pt/Ti bilayer bottom electrode was used. The Ti layer,
               with a thickness of ~10 nm, is the adhesion layer to bond with the Si substrate. The deposition process was
               carried out on a (100) Si substrate at 300 °C via dc magnetron sputtering in a pure Ar atmosphere. The
               resulting Pt layer showed a high degree of (111) texture. It is noteworthy that these platinized Si substrates
               are also commercially available for this purpose. The (100) Si substrates (10 mm × 10 mm) and ceramic
               targets of BaTiO  and LaNiO  (Φ = 50 mm, t = 5 mm, 99.9% purity) were purchased from the Anhui
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               Institute of Optics, Chinese Academy of Science. The Pt and Ti sputtering targets (Φ = 50 mm, t = 3 mm,
               99.99% purity) were purchased from Zhongnuo Advanced Material Technology Co. Limited (Beijing,
               China). The key deposition parameters of the LaNiO -buffered and unbuffered BaTiO  film heterostructures
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               are summarized in Table 1. Dot-shaped Au top electrodes (Φ = 0.2 mm) were sputtered through a masked
               plate at room temperature for electrical measurements.

               The microstructure of the two types of BaTiO  thin film heterostructures was characterized by using X-ray
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               diffraction (XRD) θ-2θ scans in a commercial Rigaku Dmax-rc XRD diffractometer equipped with a Ni-
               filtered Cu K radiation source. The surface morphologies were analyzed via atomic force microscopy (AFM)
               on a MicroNano D-5A scanning probe microscope (Shanghai, China). The layer thicknesses and
               nanostructures of the BaTiO  thin film heterostructures were analyzed via transmission electron microscopy
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               (TEM) using a JEM-2010 microscope (JEOL, Japan). The room temperature FE hysteresis loops (P-V) were
               measured at 100 Hz via a commercial Multiferroic  FE tester (Radiant Technology, USA). The voltage-
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               dependent capacitance (C-V) curves, from which the relative dielectric permittivity and loss tangent as
               functions of the applied voltage/field were obtained, were measured by using a B1505A impedance analyzer
               (Agilent Technologies, USA) at 5 kHz by applying a small ac signal of 50 mV. The voltage was swept from
               negative maximum to positive maximum and vice versa during the measurements.


               RESULTS AND DISCUSSION
               Figure 1 shows the XRD θ-2θ scan patterns of the BaTiO /Pt/Ti/Si [Figure 1A] and BaTiO /LaNiO / Pt/Ti/Si
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               [Figure 1B] thin film heterostructures, respectively. It can be clearly seen that while the unbuffered BaTiO
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               film showed a typical polycrystalline structure, the LaNiO  buffered BaTiO  film was (001)-textured, as
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               reported in our previous publications [13-15] . Furthermore, the degree of crystallinity was significantly
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