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Yan et al. Soft Sci. 2025, 5, 8  https://dx.doi.org/10.20517/ss.2024.66         Page 27 of 34

               Table 4. Summary of properties of different flexible EMI PCCs
                                    Phase change                     EMI shielding
                    Type of filler                    Properties                 Potential direction  Refs.
                                    packaging technology             and enthalpy
                MP P         MXene  Microencapsulation  Skin affinity   87.80 dB   Personal thermal management   [140]
                  2 1
                                                      High mechanical   141.4 J/g  EMI protection
                                                      property
                                                      Thermoregulation
                                                      Excellent thermal
                                                      storage
                PCC/MXene/PVA                         High mechanical   43.13 dB                      [141]
                                                      property       136.80 J/g
                                                      High thermal
                                                      conductivity
                                                      High electrical
                PCNF         SWCNTs Polymer molding   Breathability   21.50 dB   Wearable phase change fabrics  [142]
                                                      Water resistance   65.00 J/g  and EMI protection
                                                      Thermal regulation
                                                      Radiation resistance
                                                      Tensile properties
                SPP                                   High mechanical   51.70 dB   Heat dissipation and EMI   [143]
                                                      property       119.20 J/g  shielding of small electronic
                                                      Excellent thermal          devices
                                                      storage
                                                      Thermal stability
                SSPCCs       CNTs   Porous adsorption  High thermal   41.20 dB   Thermal management of   [144]
                                                      conductivity   133.80 J/g  mobile phones
                                                      Thermal stability
                                                      High mechanical
                                                      property
                CPCM         GO                       High thermal   45.00 dB    Thermal management and EMI  [145]
                                                      conductivity   175.80 J/g  shielding of electronic devices
                                                      Radiation resistance
                                                      Shape stability
                MGGF         GO                       Thermal/electrical   55.60 dB   Cooling and anti-EMI of   [146]
                             MXene                    behavior       160.30 J/g  electronic equipment
                                                      Thermal reliability
                                                      Shape stability
                FMP          Ag     Polymer molding   High mechanical   35.42 dB   EMI shielding and thermal   [147]
                                                      property       120.00 J/g  management of high-power
                                                      High thermal               devices
                                                      conductivity
                                                      High electrical
                                                      Durability
                MPA -PEG     AgNPs  Porous adsorption  Shape memory   82.02 dB   CPU thermal management  [148]
                   χ
                                                      performance    148.90 J/g
                                                      Excellent thermal
                                                      storage
                                                      High mechanical
                                                      property
                PCM-coated A-  AgNWs  Polymer molding  Joule heating   72.00 dB   Wearable EMI protection and   [149]
                textile                               Excellent thermal   138.90 J/g  personal thermal management
                                                      storage
                                                      Infrared anti-
                                                      counterfeiting
                                                      High thermal
                                                      conductivity

               EMI: Electromagnetic interference; PCCs: phase change composites; PVA: polyvinyl alcohol; PCNF: phase-change nonwoven fabric; SWCNTs:
               single-walled carbon nanotubes; SPP: SWCNT/PEG/PDMS; SSPCCs: shape-stabilized PCCs; CNTs: carbon nanotubes; CPCM: composite phase
               change material; GO: graphene oxide; MGGF: MXene-graphene foam; FMP: flexible and magnetically fastened phase change material; PEG:
               polyethylene glycol; AgNPs: silver nanoparticles; PCM: phase change material; AgNWs: silver nanowires.


               operation and protect against damage from thermal shock, the PCM, as a new type of energy storage
               material, can provide thermal management. When combined with flexible electromagnetic shielding
               materials, the PCM design enhances both EMI shielding effect and thermal management performance. This
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