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Wu et al. Soft Sci 2024;4:42 https://dx.doi.org/10.20517/ss.2024.51 Page 11 of 13
CONCLUSIONS
In summary, we demonstrate porous CoFe/Co@NC heterostructures derived from CoFe-MOF, in which
dual magnetic particles (0D solid Co nanospheres and hollow CoFe nanospheres) embedded on 2D NC
nanosheets through a simple chemical precipitation method and pyrolysis process. By regulating the
pyrolysis temperature, the balance of dual magnetic particle (CoFe, Co) content is achieved, resulting in
good impedance matching characteristics. The large number of heterogeneous interfaces, good conductive
networks and multi-component magnetic nanoparticles in the CoFe/Co@NC heterostructure bring
considerable interface polarization, conduction loss, and magnetic loss characteristics, thereby achieving
robust EMW absorption performance. When the matching thickness is only 1.78 mm, the CoFe/Co@NC
heterostructure achieves a very strong R (-73.8 dB) and a wide EAB of 5.4 GHz. CST simulations confirm
L
the potential of CoFe/Co@NC heterostructures in radar stealth. This work provides a solid foundation for
dual magnetic particles to achieve magnetoelectric synergy for the improvement of EMW absorption at
ultrathin thickness.
DECLARATIONS
Authors’ contributions
Data curation, investigation, methodology, software, writing - original draft, writing - review and editing:
Wu Z
Software, Writing - review and editing: Huang J
Conceptualization, funding acquisition, project administration, resources, supervision, writing - original
draft, writing - review and editing: Zeng X
Availability of data and materials
The data presented in this study is available upon request from the corresponding author.
Financial support and sponsorship
This work was supported by the National Natural Science Foundation of China (No. 22269010), the Jiangxi
Provincial Natural Science Foundation (No. 20224BAB214021), and the Major Research Program of
Jingdezhen Ceramic Industry (No. 2023ZDGG002).
Conflicts of interest
All authors declared that there are no conflicts of interest.
Ethical approval and consent to participate
Not applicable.
Consent for publication
Not applicable.
Copyright
© The Author(s) 2024.
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