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All authors have read and agreed to the published version of the manuscript.

Availability of data and materials
Data sharing is not applicable to this article as no datasets were generated or analyzed during the current
study.

Financial support and sponsorship
This work was financially supported by the National Defense Basic Scientific Research Program (Grant Nos.
211-CXCY-N103-03-04-00 and 2022-JCKY-JJ-1086).

Conflicts of interest
Wang, W. Y. is an Editor in the Junior Editorial Board of Journal of Materials Informatics. Wang, W. Y. was
not involved in any steps of the editorial process, notably including the selection of reviewers, manuscript
handling, or decision-making. The other authors declare that there are no conflicts of interest.

Ethical approval and consent to participate
Not applicable.

Consent for publication
Not applicable.

Copyright
© The Author(s) 2026.

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