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Kim et al. Soft Sci 2024;4:12                                             Soft Science
               DOI: 10.20517/ss.2023.50



               Perspective                                                                   Open Access



               Coupled mechanics in skin-interfaced electronics

               via computer vision methods


               Jin-Tae Kim 1,#,*  , Leonardo P. Chamorro 2,3,4,5,#,*
               1
                Department of Mechanical Engineering, Pohang University of Science and Technology, Pohang 37673, Republic of Korea.
               2
                Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL 61801, USA.
               3
                Department of Aerospace Engineering, University of Illinois, Urbana, IL 61801, USA.
               4
                Department of Civil and Environmental Engineering, University of Illinois, Urbana, IL 61801, USA.
               5
                Department of Geology, University of Illinois, Urbana, IL 61801, USA.
               #
                Authors contributed equally.
               * Correspondence to: Dr. Jin-Tae Kim, Department of Mechanical Engineering, Pohang University of Science and Technology,
               50, Jigok-ro 127beon-gil, Nam-gu, Pohang 37673, Republic of Korea. E-mail: kjt516@gmail.com; Dr. Leonardo P. Chamorro,
               Department of Mechanical Science and Engineering, University of Illinois, 1206 W Green St, Urbana, IL 61801, USA. E-mail:
               lpchamo@illinois.edu
               How to cite this article: Kim JT, Chamorro LP. Coupled mechanics in skin-interfaced electronics via computer vision methods.
               Soft Sci 2024;4:12. https://dx.doi.org/10.20517/ss.2023.50
               Received: 8 Nov 2023  First Decision: 8 Dec 2023  Revised: 15 Dec 2023  Accepted: 12 Jan 2024  Published: 21 Feb 2024
               Academic Editors: Zhifeng Ren, Sang Min Won  Copy Editor: Pei-Yun Wang  Production Editor: Pei-Yun Wang


               Abstract
               Recent advancements in materials and mechanics have paved the way for transforming rigid circuits into flexible
               electronics. Their ability to laminate onto the skin has led to the development of skin-interfaced electronics,
               including mechano-acoustic sensors and haptic systems. However, the challenges of the coupled mechanics
               between the skin and skin-interfaced electronics call for further understanding of biomechanics, bioelectronics, and
               their interactions. This perspective article highlights the emerging trend of employing computer vision methods to
               optimize the next generation of skin-interfaced electronics by characterizing associated biomechanics and vice
               versa. The cyclic research process involves the development of soft electronics, the identification of coupled
               mechanics, and their quantification using computer vision methods. The article describes state-of-the-art
               computer vision techniques in the context of skin-interfaced electronics and their potential applications in other
               forms of soft electronics.

               Keywords: Soft electronics, skin-interfaced electronics, mechano-acoustic sensors, haptic interfaces, computer
               vision









                           © The Author(s) 2024. Open Access This article is licensed under a Creative Commons Attribution 4.0
                           International License (https://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, sharing,
                           adaptation, distribution and reproduction in any medium or format, for any purpose, even commercially, as
               long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and
               indicate if changes were made.

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