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Kim et al. Soft Sci 2024;4:12 https://dx.doi.org/10.20517/ss.2023.50 Page 9 of 11

programmable surfaces [23,31] , and implantable devices [13,15] . To fully harness the potential of these
technologies, a comprehensive grasp of both the manufacturing intricacies of flexible electronics and the
data processing schemes using computer vision methods is critical. Despite recent progress, several
challenges persist in fully integrating computer vision technologies into soft electronics. For instance,
volumetric measurements, such as 3D PTV or Digital Volumetric Correlation (DVC), still lack sufficient
data resolution or require a large number of cameras, creating a bottleneck in quantification. Another
challenge arises in the experimental setup, requiring a controlled optical environment, especially for
simultaneous measurements using multiple techniques. This controlled environment may not be adequate
for validating and quantifying the associated mechanics of soft electronic devices during situations where
optical access is limited, such as in-vivo testing. However, these limitations address future opportunities. For
[33]
[32]
example, image processing algorithms, such as “Shake-The-Box” and deep learning for PIV/PTV and
DIC , could be integrated to improve data resolution. Instead of relying on existing computer vision
[34]
techniques, new methods tailored specifically for optimizing soft electronics could be developed. For
instance, by combining infrared imaging techniques, thermal-mechanical behaviors associated with
wearable devices could be investigated to address all possible safety hazards . Future research could involve
[35]
developing (i) a novel haptic system targeted for multisensory engagement based on the measured coupled
mechanics using PTV and DIC; (ii) a multimodal skin-integrated sensor for cardiac monitoring validated by
EVM; (iii) a wearable motion sensor for orthopedic applications, calibrated with MPE; and (iv) soft tunable
electronic camera systems embedded with computer vision processing capabilities. This transdisciplinary
research, combining soft electronic technologies and computer vision measurements with a fundamental
understanding of continuum mechanics, is key to realizing the next generation of soft electronic systems.

DECLARATIONS
Authors’ contributions
Conceived the ideas, and wrote the manuscript: Kim JT, Chamorro LP

Availability of data and materials
Not applicable.

Financial support and sponsorship
The work was supported by the Querrey-Simpson Institute for Bioelectronics at Northwestern University
and the Department of Mechanical Engineering at Pohang University of Science and Technology as part of
the start-up package of Kim JT.

Conflicts of interest
Both authors declared that there are no conflicts of interest.

Ethical approval and consent to participate
Not applicable.

Consent for publication
Not applicable.

Copyright
© The Author(s) 2024.