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Page 16 of 20 Dang et al. Chem Synth 2023;3:14 https://dx.doi.org/10.20517/cs.2022.33

Structure-properties correlation: Se nanomaterials exhibit many intriguing optical, electrical,
optoelectronic, photovoltaic, and piezoelectric properties. However, a deep understanding of the structure-
properties correlation is still very limited. Harnessing sophisticated characterization techniques such as
ultrafast transient absorption spectroscopy, nanosecond flash photolysis and time-resolved terahertz
spectroscopy has paved a novel way toward this research direction . This would allow us, on the one hand,
[31]
to unravel the working principles of Se nanomaterial-based devices and, on the other hand, conversely tune
the material structure to further improve performance.

Materials assembly and device integration: Most existing Se nanomaterials suffer from agglomeration or
entanglement. Therefore, it requires a stringent post-synthesis process for materials alignment, assembly
and device integration. Even though thermal drawing produces well-aligned and exquisitely controllable in-
fiber nanomaterials, their monolithic integration with other functional materials such as electrodes for the
fabrication of flexible and wearable electronic devices remains challenging. The difficulty is twofold: the co-
drawing of Se with other functional materials is challenging because of their incompatible rheological
properties; handling materials at the nanoscale is complicated. Nevertheless, an initial step with innovative
advances in in-fiber nanowire self-assembly and simultaneous integration with built-in electrodes offers an
appealing inspiration for us to further break through the roadblock . More simpler and robust strategies
[39]
for Se nanomaterials assembly and device integration are desirable for future real-world applications.

Se nanomaterial-based flexible and wearable electronics represent a class of technology with innovative
potentials in smart sensing, health care and energy. With continued and concerted efforts in synthesis and
fabrication, control over morphologies and structure, device assembly and integration, more advanced
flexible and wearable electronics with more sophisticated functionalities and practical applications will
emerge.

DECLARATIONS
Authors’ contributions
Made substantial contributions to the conception and design of the study: Dang C, Yan W
Writing-original draft preparation and review editing: Dang C, Liu M, Lin Z, Yan W

Availability of data and materials
Not applicable.

Financial support and sponsorship
Yan W acknowledges the Nanyang Technological University (Start-up Grant 021850-00001: Yan W) and
the National Natural Science Foundation of China (Grant No. 52202167).

Conflicts of interest
All authors declared that there are no conflicts of interest.

Ethical approval and consent to participate
Not applicable.

Consent for publication
Not applicable.