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               Availability of data and materials
               Data sharing is not applicable to this article as no datasets were generated or analyzed during the current
               study.


               Financial support and sponsorship
               This  research  was  supported  by  the  National  Basic  Scientific  Research  Project  of  China  (No.
               JCKY2020607B003).

               Conflicts of interest
               Wang WY is an Editor in the Junior Editorial Board of Journal of Materials Informatics. Wang WY was not
               involved in any steps of editorial processing, notably including the selection of reviewers, manuscript
               handling and decision-making. Li G, Ren Y and Sun F are affiliated with Western Superconducting
               Technologies Co., Ltd. The other authors declare that there are no conflicts of interest.

               Ethical approval and consent to participate
               Not applicable.

               Consent for publication
               Not applicable.


               Copyright
               © The Author(s) 2024.


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