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Availability of data and materials
Data sharing is not applicable to this article as no datasets were generated or analyzed during the current
study.
Financial support and sponsorship
This research was supported by the National Basic Scientific Research Project of China (No.
JCKY2020607B003).
Conflicts of interest
Wang WY is an Editor in the Junior Editorial Board of Journal of Materials Informatics. Wang WY was not
involved in any steps of editorial processing, notably including the selection of reviewers, manuscript
handling and decision-making. Li G, Ren Y and Sun F are affiliated with Western Superconducting
Technologies Co., Ltd. The other authors declare that there are no conflicts of interest.
Ethical approval and consent to participate
Not applicable.
Consent for publication
Not applicable.
Copyright
© The Author(s) 2024.
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