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Page 24 of 35   Martin-Gonzalez et al. Energy Mater. 2025, 5, 500121  https://dx.doi.org/10.20517/energymater.2025.32

               studied method is the so-called band alignment (or band-convergence) in which multi-band electronic
               structures undergo specific alloying such that many bands are aligned in energy and all contribute to
               transport. Many other concepts are explored, such as resonant states, topological effects, defect engineering,
               and transport in low bandgap materials and/or semimetals. The exploration of these newly emerged
               physics-based concepts and their integration into different materials is only the starting point, and many
               exciting outcomes are expected in the future in the field of thermoelectrics.

               However, the transition from thermoelectric materials to TEG devices presents its own set of challenges that
               must be addressed for successful commercialization of these materials with high efficiency. Key issues
               include interface engineering, where the complexity of interfaces between different TE materials can lead to
               increased thermal and electrical contact resistance, negatively impacting efficiency. Material degradation
               during operation, particularly due to chemical reactions with moisture and diffusion processes, can
               compromise the integrity and performance of the modules. Additionally, careful matching of thermal
               expansion coefficients is crucial to prevent mechanical stresses that can lead to cracking and delamination.
               The soldering and bonding processes used to connect TE materials to electrodes also present challenges, as
               traditional soldering materials may not provide adequate thermal and electrical conductivity. Finally, the
               mechanical stability of TEGs under varying thermal and mechanical loads must be ensured to withstand
               harsh environments and repeated thermal cycling. Addressing these challenges is essential for the successful
               integration of TEG technology into practical applications, and ongoing research is vital to optimize
               materials for stability, performance, and cost-effectiveness.


               DECLARATIONS
               Acknowledgments
               The authors acknowledge funding from the European Research Council (ERC) under the European Union’s
               Horizon 2020 Research and Innovation Programme ERC Advanced  and ERC Starting Grant.

               Authors’ contributions
               Conceptualization, data curation, writing - original draft: Martin-Gonzalez, M.
               Data curation, writing: Lohani, K.
               Conceptualization, data curation, writing - original draft: Neophytou, N.


               Availability of data and materials
               Not applicable.

               Financial support and sponsorship
               This work was supported by a Grant named ERC Advanced (POWERbyU Grant Agreements No.
               101052603) and ERC Starting Grant (NANOthermMA grant agreement No. 678763).


               Conflicts of interest
               All authors declared that there are no conflicts of interest.


               Ethical approval and consent to participate
               Not applicable.


               Consent for publication
               Not applicable.
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